SOFP2-LR4-10
RoHS Compliant 100Gb/s CFP2 LR4 10km Optical Transceiver
PRODUCT FEATURES
l Duplex LC receptacle optical interface
l Single +3.3V power supply
l Hot-pluggable
l Operating optical data rate up to 112Gbps
l Operating electrical serial data rate up to
27.952493Gbps
l 4 parallel electrical serial interface
l AC coupling of CML signals
l PIN ROSA
l Low power dissipation(Max:9W)
l Built in digital diagnostic function
l Operating case temperature range:0℃ to 70℃
l Compliant with 100GBASE-LR4 and OTU4
l MDIO Communication Interface
l Compatible with all kinds of
commercial ONT
APPLICATIONS
l Local Area Network(LAN)
l Wide Area Network(WAN)
l Switch to router interface
l ITU-T OTU4 OTL4.4 applications
Standards
l Compliant with IEEE 802.3ba
l Compliant with CFP2 MSA hardware specifications
l Compliant with CFP2 MSA management specifications
l Compliant with ITU-T G709/Y.1331
l Compliant with RoHS
Functional
Description
The
100G CFP2 LR4 optical transceiver integrates the transmit and receive path onto
one module. On the transmit side, four lanes of serial data streams are
recovered, retimed,and passed on to four laser drivers, which control four
electric-absorption modulated lasers (EMLs) with 1296, 1300, 1305, and 1309 nm
center wavelengths. The optical signals are then multiplexed into a single-mode
fiber through an industry-standard LC connector.On the receive side, four lanes
of optical data streams are optically demultiplexed by an integrated optical
demultiplexer. Each data steam is recovered by a PIN photodetector and transimpedance
amplifier, retimed, and passed on to an output driver. This module features a
hot-pluggable electrical interface, low power
consumption, and MDIO management interface.
Block diagram

Absolute Maximum Ratings
|
Parameter
|
Symbol
|
Min
|
Typ
|
Max
|
Units
|
Notes
|
|
Storage Temperature
|
Tst
|
-40
|
|
+85
|
ºC
|
|
|
Supply Voltage
|
Vcc
|
-0.5
|
|
+3.6
|
V
|
|
|
Operating Relative
Humidity
|
Rh
|
+5
|
|
+95
|
%
|
|
Recommended Operating Conditions
|
Parameter
|
Symbol
|
Min
|
Typ
|
Max
|
Units
|
Notes
|
|
Operating Case Temperature
|
TC
|
0
|
-
|
+70
|
°C
|
|
|
Power Supply Voltage
|
VCC
|
3.14
|
3.3
|
3.46
|
V
|
|
|
Data rate
|
|
|
103.125
|
112
|
Gb/s
|
|
Specifications
(tested under recommended
operating conditions,unless otherwise noted)
|
Parameter
|
Symbol
|
Unit
|
Min
|
Typ
|
Max
|
Notes
|
|||||||||
|
Voltage Supply Electrical Characteristics
|
|||||||||||||||
|
Supply
Current
|
Tx Section
|
Icc
|
A
|
|
|
3.75
|
1
|
||||||||
|
Rx Section
|
|||||||||||||||
|
Power Supply
Noise
|
Vrip
|
|
|
|
2% DC
|
1MHz
|
|||||||||
|
3% 1
|
10MHz
|
||||||||||||||
|
Total
Dissipation Power
|
Class1
|
Pw
|
W
|
|
|
3
|
|
||||||||
|
Class2
|
6
|
||||||||||||||
|
Class3
|
9
|
||||||||||||||
|
Class4
|
12
|
||||||||||||||
|
Low Power Mode
Dissipation
|
Plow
|
W
|
|
|
2
|
|
|||||||||
|
Inrush
Current
|
Class1
|
and
|
I-inrush
|
mA/usec
|
|
|
100
|
|
|||||||
|
Turn-off
Current
|
Class2
|
I-turnoff
|
mA/usec
|
-100
|
|
|
|
||||||||
|
Inrush
Current
|
Class3
|
and
|
I-inrush
|
mA/usec
|
|
|
200
|
|
|||||||
|
Turn-off
Current
|
Class4
|
I-turnoff
|
mA/usec
|
-200
|
|
|
|
||||||||
|
Different Signal Electrical Characteristics
|
|||||||||||||||
|
Single Ended Data Input Swing
|
|
mV
|
20
|
|
525
|
|
|||||||||
|
Single Ended Data Output Swing
|
|
mV
|
180
|
|
385
|
|
|||||||||
|
Differential Signal
Output
Resistance
|
|
Ω
|
80
|
|
120
|
|
|||||||||
|
Differential Signal
Input
Resistance
|
|
Ω
|
80
|
|
120
|
|
|||||||||
|
3.3V
LVCMOS Electrical Characteristics
|
|||||||||||||||
|
Input High Voltage
|
3.3VIH
|
V
|
2.0
|
|
Vcc+0.3
|
|
|||||||||
|
Input Low Voltage
|
3.3VIL
|
V
|
-0.3
|
|
0.8
|
|
|||||||||
|
Input Leakage Current
|
3.3IIN
|
uA
|
-10
|
|
+10
|
|
|||||||||
|
Output High
Voltage
(IOH=100uA)
|
3.3VOH
|
V
|
Vcc-0.2
|
|
|
|
|||||||||
|
Output Low Voltage (IOL=100uA)
|
3.3VOL
|
V
|
|
|
0.2
|
|
|||||||||
|
Minimum Pulse Width
of Control
Pin Signal
|
t_CNTL
|
us
|
100
|
|
|
|
|||||||||
|
1.2V LVCMOS Electrical
Characteristics
|
|||||||||||||||
|
Input High
Voltage
|
1.2VIH
|
V
|
0.84
|
|
1.5
|
|
|||||||||
|
Input Low
Voltage
|
1.2VIL V
|
0.3
|
1.2VIL V
|
|
0.36
|
|
|||||||||
|
Input Leakage
Current
|
1.2IIN
|
uA
|
-100
|
|
+100
|
|
|||||||||
|
Output High
Voltage
|
1.2VOH
|
V
|
1.0
|
|
1.5
|
|
|||||||||
|
Output Low
Voltage
|
1.2VOL
|
V
|
-0.3
|
|
0.2
|
|
|||||||||
|
Output High
Current
|
1.2IOH
|
mA
|
|
|
-4
|
|
|||||||||
|
Output Low
Current
|
1.2IOL
|
mA
|
+4
|
|
|
|
|||||||||
|
Input
Capacitance
|
Ci
|
pF
|
|
|
10
|
|
|||||||||
|
Optical Transmitter Characteristics
|
|||||||||||||||
|
Signaling
rate, each lane
|
|
GBd
|
25.78125 ±100
ppm
|
100GBase-LR4
|
|||||||||||
|
27.9525 ±20
ppm
|
OTU4
|
||||||||||||||
|
Four Lane Wavelength Range
|
λ1
|
nm
|
1294.53
|
1295.56
|
1296.59
|
|
|||||||||
|
λ2
|
1299.02
|
1300.05
|
1301.09
|
|
|||||||||||
|
λ3
|
1303.54
|
1304.58
|
1305.63
|
|
|||||||||||
|
λ4
|
1308.09
|
1309.14
|
1310.19
|
|
|||||||||||
|
Total launch power
|
|
dBm
|
|
|
10.5
|
100GBase-LR4
|
|||||||||
|
|
|
10
|
OTU4
|
||||||||||||
|
Average launch power, each lane
|
Pavg
|
dBm
|
-4.3
|
|
4.5
|
2
|
|||||||||
|
-0.6
|
|
4
|
|||||||||||||
|
Optical modulation amplitude, each lane (OMA)2
|
OMA
|
dBm
|
-1.3
|
|
4.5
|
|
|||||||||
|
Difference in launch power between any two lanes (OMA)
|
|
dB
|
|
|
5
|
|
|||||||||
|
Extinction ratio
|
ER
|
dB
|
4
|
|
|
100GBase-LR4
|
|||||||||
|
4
|
|
6.5
|
OTU4
|
||||||||||||
|
Side-mode suppression ratio
|
SMSR
|
dB
|
30
|
|
|
|
|||||||||
|
Transmitter and dispersion penalty, each lane
|
TDP
|
dB
|
|
|
2.2
|
|
|||||||||
|
Optical return loss tolerance
|
|
dB
|
|
|
20
|
|
|||||||||
|
Transmitter reflectance3
|
|
dB
|
|
|
–12
|
|
|||||||||
|
Transmitter eye mask {X1, X2, X3, Y1, Y2, Y3}
|
|
|
{0.25, 0.4, 0.45,
0.25, 0.28, 0.4}
|
100GBase-LR4
|
|||||||||||
|
Optical Receiver Characteristics
|
|||||||||||||||
|
Receive Rate for Each Lane
|
|
Gbps
|
|
25.78125
|
27.9525
|
|
|||||||||
|
Overload Input Optical Power
|
Pmax
|
dBm
|
5.5
|
|
|
3
|
|||||||||
|
Average Receive
Power for Each
Lane
|
Pin
|
dBm
|
-8.6 + ∆
|
|
3
|
4, 5,
9
|
|||||||||
|
Receive Power In
OMA for Each
Lane
|
PinOMA
|
dBm
|
|
|
3
|
|
|||||||||
|
Difference in
Receive Power in
OMA between Any Two Lanes
|
|
dBm
|
|
|
|
|
|||||||||
|
Receiver
Sensitivity in OMA for
Each Lane
|
SOMA
|
dBm
|
|
|
-8.6 + ∆
|
6
|
|||||||||
|
Stressed Receiver
Sensitivity in
OMA for Each Lane
|
|
dBm
|
|
|
-6.8
+ ∆
|
7, 8,
9
|
|||||||||
Note1. The supply current includes CFP2 module’s supply
current and test board working
current.
Note2. Average launch power, each lane (min) is
informative for 100GBase-LR4, not the principal indicator of signal strength.
Note3.The receiver shall be able to tolerate , without
damage, continuous exposure to an
optical input signal having this average power level
Note4. The average receive power , each lane (max) for
100GBASE-ER4 is larger than the
100BASE-ER4 transmitter value to allow
compatibility with 100BASE-LR4 units at short
distances
Note5. Average receive power, each lane (min) is
informative and not the principal indicator
of signal strength. A received power below this
value cannot be compliant; however, a value
above this does not ensure compliance
Note6. Receiver sensitivity (OMA), each lane (max) is
informative
Note7. Measured with conformance test signal at TP3 for
BER=10-12
Note8. conditions of stressed receiver sensitivity test:
vertical eye closure penalty for each
lane is 1.8dB;stressed eye J2 jitter for each
lane is 0.3UI; stressed eye J9 jitter for each lane
is 0.47UI.
Note9. ∆ = ADP ROSA sensitivity (a negative number) -
(-8.6dBm) - (-1.9dB (DeMUX insertion loss)) - δ (a negotiable additional loss).
Hardware
Control Pins
The CFP2 Module
support real-time control functions via hardware pins, listed in the following
table: Hardware
Control Pins
Hardware Control Pins
|
Pin
|
Symbol
|
Description
|
I/O
|
Logic
|
H
|
L
|
Pull-up
/down
|
|
17
|
PRG_CNTL1
|
Programmable
Control 1
MSADefault:TRXIC_RST
n , TX&RX ICs
reset,
“0”:reset;”1”
|
I
|
3.3V
LVCMOS
|
per CFP MSA
Management
Interface
Specification
|
|
Pull-Up
Note1
|
|
18
|
PRG_CNTL2
|
Programmable
Control 2
MSADefault
:Hardware
Interlock LSB
|
I
|
3.3V
LVCMOS
|
Pull-Up
Note1
|
||
|
19
|
PRG_CNTL3
|
Programmable
Control 3
MSA
Default:Hardware
Interlock MSB
|
I
|
3.3V
LVCMOS
|
Pull-Up
Note1
|
||
|
26
|
MOD_LOPWR
|
Module Low Power Mode
|
I
|
3.3V
LVCMO
S
Low
Power
Enabl
e
Pull-Up
Note1
|
Low
Power
|
Enabl
e
|
Pull-Up
Note1
|
|
28
|
MOD_RSTn
|
Module Reset(Invert)
|
I
|
3.3V
LVCMO
S
|
Enabl
e
|
Reset
|
Pull-Down
Note2
|
Note1: Pull-Up resistor (4.7KOhm to 10 KOhm) is located
within the CFP2 module
Note2: Pull-Down resistor (4.7KOhm to 10 kOhm) is
located within the CFP2 module
Hardware
Alarm Pins
The CFP2 Module
supports alarm hardware pins listed in the following table: Hardware Alarm
Pins
Hardware Alarm Pins
|
Pin
|
Symbol
|
Description
|
I/O
|
Logic
|
H
|
L
|
Pull-up
/down
n
|
|
20
|
PRG_ALRM
1
|
Programmable
Alarm 1
MSA
Default:HIPWR_ON
|
0
|
3.3V
LVCMO
S
|
Active High per
MDIO document
|
|
|
|
21
|
PRG_ALRM
2
|
Programmable
Alarm 2
MSA
default:MOD_READY
, Ready
State has been
reached
|
0
|
3.3V
LVCMO
S
|
|
||
|
22
|
PRG_ALRM
3
|
Programmable
Alarm 3
MSA Default: MOD_FAULT
|
0
|
3.3V
LVCMO
S
|
|
||
|
27
|
MOD_ABS
|
Module Absent
|
0
|
3.3V
LVCMO
S
|
Absent
|
Present
|
Pull-Down
Note1
|
|
25
|
RX_LOS
|
Receiver Loss of
Signa
|
0
|
3.3V
LVCMO
S
|
Loss of
Signal
|
OK
|
|
Note1: Pull-Down resistor (<100Ohm) is located within
the CFP2 module. Pull-up should be
located on the host
Management Interface Pins(MDIO)
The CFP2 Module
supports alarm, control and monitor functions via an MDIO bus. The CFP2
MDIO pins are listed in the following table:
Management Interface Pins
Management Interface
Pins
|
Pin
|
Symbol
|
Description
|
I/O
|
Logic
|
H
|
L
|
Pull-up
/down
n
|
|
29
|
GLB-ALRMn
|
Global Alarm
|
I
|
3.3V
LVCMOS
|
OK
|
Alarm
|
|
|
32
|
MDIO
|
Management interface bidirectional
data
|
I/O
|
1.2V LVCMOS
|
|
|
|
|
31
|
MDC
|
Management interface
clock input
|
I
|
1.2V LVCMOS
|
|
|
|
|
33
|
PRTADR0
|
MDIO physical port address bit 0
|
I
|
1.2V LVCMOS
|
Per MDIO
|
|
|
|
34
|
PRTADR1
|
MDIO physical port address bit 1
|
I
|
1.2V LVCMOS
|
|
||
|
35
|
PRTADR2
|
MDIO physical port address bit 2
|
I
|
1.2V LVCMOS
|
|
||
Hardware
Signaling Pin Timing Requirements
Timing Parameters
for CFP2 hardware Signal Pins are listed in the following table
|
Parameter
|
Symbol
|
Unit
|
Min.
|
Max.
|
Notes
|
|
Hardware MOD_LOPWR assert
|
t_MOD_LOPWR_assert
|
ms
|
|
1
|
|
|
Hardware MOD_LOPWR deassert
|
t_MOD_LOPWR_deassert
|
s
|
|
60
|
Stored in NVR register 8072h
|
|
Management interface clock period
|
t_prd
|
ns
|
250
|
|
MDC is 4 MHz rate or less
|
|
Host MDIO setup time
|
t_setup
|
ns
|
10
|
|
|
|
Host MDIO hold time
|
t_hold
|
ns
|
10
|
|
|
|
CFP2 MDIO delay time
|
t_delay
|
ns
|
0
|
175
|
|
|
GLB_ALRM assert time
|
GLB_ALRMn_assert
|
ms
|
|
150
|
A logic “OR” of associated MDIO alarm and
status registers
|
|
GLB_ALRM deassert time
|
GLB_ALRMn_deassert
|
ms
|
|
150
|
A logic “OR” of associated MDIO alarm and
status registers
|
|
Minimum pulse width of control pin signal
|
t_CNTL
|
μs
|
100
|
|
|
|
Initialization time from reset
|
t_initialize
|
s
|
|
2.5
|
|
|
TX_Disable assert time
|
t_deassert
|
μs
|
|
100
|
Transmitter disable, application specific
|
|
TX_Disable deassert time1
|
t_assert
|
ms
|
|
5
|
Time from Tx Disable pin deasserted until CFP2
module enters the Tx-turn-on state
Stored in NVR register 8073h
|
|
RX_LOS assert time
|
t_loss_assert
|
μs
|
|
100
|
From occurrence of loss of signal to assertion
of RX_LOS
|
|
RX_LOS deassert time
|
t_loss_deassert
|
μs
|
|
100
|
From occurrence of return of signal to deassert
of RX_LOS
|
High
Speed Electrical Characteristics
Reference Clock Characteristics
|
Parameter
|
Symbol
|
Unit
|
Min.
|
Max.
|
Notes
|
|
Impedance
|
Zd
|
Ω
|
90
|
110
|
|
|
Frequency
|
|
MHz
|
161.1328125
|
1/64 of electrical lane rate
|
|
|
Frequency Stability
|
△f
|
ppm
|
-100
|
100
|
For Ethernet
|
|
-20
|
20
|
For Telecom
|
|||
|
Differential Voltage
|
VDIFF
|
mV
|
400
|
900
|
Peak to Peak Differential
|
|
Common mode noise (rms)
|
|
mV
|
|
17.5
|
|
|
RMS jitter
|
|
ps
|
|
10
|
Random Jitter Over frequency band of
10KHZ<f<10MHZ
|
|
Clock Duty Cycle
|
|
%
|
40
|
60
|
|
Pin
Description
The CFP2 connector
has 104 pins which are arranged in Top and Bottom rows. The pin map is shown in
Table below.
![]() |
![]() ![]() |
Table: Pin description
|
Pin
|
Name
|
I/O
|
Logic
|
Description
|
|
1
|
GND
|
|
|
|
|
2
|
(TX_MCLKn)
|
O
|
CML
|
For optical waveform testing. Not
for normal use.
|
|
3
|
(TX_MCLKp)
|
O
|
CML
|
For optical waveform testing. Not
for normal use.
|
|
4
|
GND
|
|
|
|
|
5
|
N.C
|
|
|
No Connect
|
|
6
|
N.C
|
|
|
|
|
7
|
3.3V_GND
|
|
|
3.3V Module Supply Voltage Return
Ground, can be separate or tied together with Signal Ground
|
|
8
|
3.3V_GND
|
|
|
|
|
9
|
3.3V
|
|
|
3.3V Module Supply Voltage
|
|
10
|
3.3V
|
|
|
|
|
11
|
3.3V
|
|
|
|
|
12
|
3.3V
|
|
|
|
|
13
|
3.3V_GND
|
|
|
3.3V Module Supply Voltage Return
Ground, can be separate or tied together with Signal Ground
|
|
14
|
3.3V_GND
|
|
|
|
|
15
|
VND_IO_A
|
I/O
|
|
Module Vendor I/O A. Do Not
Connect!
|
|
16
|
VND_IO_B
|
I/O
|
|
Module Vendor I/O A. Do Not
Connect!
|
|
17
|
PRG_CNTL1
|
I
|
LVCMOS w/ PUR
|
Programmable Control 1 set over
MDIO, MSA Default: TRXIC_RSTn, TX & RX ICs reset, "0": reset,
"1" or NC: enabled = not used
|
|
18
|
PRG_CNTL2
|
I
|
LVCMOS w/ PUR
|
Programmable Control 2 set over
MDIO, MSA Default: Hardware Interlock LSB, "00": ≤3W,
"01": ≤6W, "10": ≤9W, "11" or NC: ≤12W = not
used
|
|
19
|
PRG_CNTL3
|
I
|
LVCMOS w/ PUR
|
Programmable Control 2 set over
MDIO, MSA Default: Hardware Interlock LSB, "00": ≤3W,
"01": ≤6W, "10": ≤9W, "11" or NC: ≤12W = not
used
|
|
20
|
PRG_ALRM1
|
O
|
LVCMOS
|
Programmable Alarm 1 set over
MDIO, MSA Default: HIPWR_ON, "1": module power up completed,
"0": module not high powered up
|
|
21
|
PRG_ALRM2
|
O
|
LVCMOS
|
Programmable Alarm 2 set over
MDIO, MSA Default: MOD_READY, "1": Ready, "0": not Ready.
|
|
22
|
PRG_ALRM3
|
O
|
LVCMOS
|
Programmable Alarm 3 set over
MDIO, MSA Default: MOD_FAULT, fault detected, "1": Fault,
"0": No Fault
|
|
23
|
GND
|
|
|
|
|
24
|
TX_DIS
|
I
|
LVCMOS w/ PUR
|
Transmitter Disable for all
lanes, "1" or NC = transmitter disabled, "0" =
transmitter enabled
|
|
25
|
RX_LOS
|
O
|
LVCMOS
|
Receiver Loss of Optical Signal,
"1": low optical signal, "0": normal condition
|
|
26
|
MOD_LOPWR
|
I
|
LVCMOS w/ PUR
|
Module Low Power Mode.
"1" or NC: module in low power (safe) mode, "0": power-on
enabled
|
|
27
|
MOD_ABS
|
O
|
GND
|
Module Absent. "1" or
NC: module absent, "0": module present, Pull Up Resistor on Host
|
|
28
|
MOD_RSTn
|
I
|
LVCMOS w/ PDR
|
Module Reset. "0"
resets the module, "1" or NC = module enabled, Pull Down Resistor
in Module
|
|
29
|
GLB_ALRMn
|
O
|
LVCMOS
|
Global Alarm. “0": alarm
condition in any MDIO Alarm register, "1": no alarm condition, Open
Drain, Pull Up Resistor on Host
|
|
30
|
GND
|
|
|
|
|
31
|
MDC
|
I
|
1.2V CMOS
|
Management Data Clock (electrical
specs as per IEEE Std 802.3ae-2008 and ba-2010)
|
|
32
|
MDIO
|
I/O
|
1.2V CMOS
|
Management Data I/O
bi-directional data (electrical specs as per IEEE Std 802.3ae-2008 and
ba-2010)
|
|
33
|
PRTADR0
|
I
|
1.2V CMOS
|
MDIO Physical Port address bit 0
|
|
34
|
PRTADR1
|
I
|
1.2V CMOS
|
MDIO Physical Port address bit 1
|
|
35
|
PRTADR2
|
I
|
1.2V CMOS
|
MDIO Physical Port address bit 2
|
|
36
|
VND_IO_C
|
I/O
|
|
Module Vendor I/O C. Do Not
Connect!
|
|
37
|
VND_IO_D
|
I/O
|
|
Module Vendor I/O D. Do Not
Connect!
|
|
38
|
VND_IO_E
|
I/O
|
|
Module Vendor I/O E. Do Not
Connect!
|
|
39
|
3.3V_GND
|
|
|
|
|
40
|
3.3V_GND
|
|
|
|
|
41
|
3.3V
|
|
|
3.3V Module Supply Voltage
|
|
42
|
3.3V
|
|
|
|
|
43
|
3.3V
|
|
|
|
|
44
|
3.3V
|
|
|
|
|
45
|
3.3V_GND
|
|
|
|
|
46
|
3.3V_GND
|
|
|
|
|
47
|
N.C
|
|
|
No Connect
|
|
48
|
N.C
|
|
|
|
|
49
|
GND
|
|
|
|
|
50
|
(RX_MCLKn)
|
O
|
CML
|
For optical waveform testing. Not
for normal use.
|
|
51
|
(RX_MCLKp)
|
O
|
CML
|
|
|
52
|
GND
|
|
|
|
|
53
|
GND
|
|
|
|
|
54
|
N.C.
|
|
|
|
|
55
|
N.C.
|
|
|
|
|
56
|
GND
|
|
|
|
|
57
|
RX0p
|
|
|
25
Gbps receiver data; Lane 0
|
|
58
|
RX0n
|
|
|
25
Gbps receiver data bar; Lane 0
|
|
59
|
GND
|
|
|
|
|
60
|
RX1p
|
|
|
25
Gbps receiver data; Lane 1
|
|
61
|
RX1n
|
|
|
25
Gbps receiver data bar; Lane 1
|
|
62
|
GND
|
|
|
|
|
63
|
N.C.
|
|
|
|
|
64
|
N.C.
|
|
|
|
|
65
|
GND
|
|
|
|
|
66
|
N.C.
|
|
|
|
|
67
|
N.C.
|
|
|
|
|
68
|
GND
|
|
|
|
|
69
|
RX2p
|
|
|
25
Gbps receiver data; Lane 2
|
|
70
|
RX2n
|
|
|
25
Gbps receiver data bar; Lane 2
|
|
71
|
GND
|
|
|
|
|
72
|
RX3p
|
|
|
25
Gbps receiver data; Lane 3
|
|
73
|
RX3n
|
|
|
25
Gbps receiver data bar; Lane 3
|
|
74
|
GND
|
|
|
|
|
75
|
N.C.
|
|
|
|
|
76
|
N.C.
|
|
|
|
|
77
|
GND
|
|
|
|
|
78
|
(REFCLKp)
|
|
CML
|
Module
reference clock. No connect.
|
|
79
|
(REFCLKn)
|
|
CML
|
Module
reference clock. No connect.
|
|
80
|
GND
|
|
|
|
|
81
|
N.C.
|
|
|
|
|
82
|
N.C.
|
|
|
|
|
83
|
GND
|
|
|
|
|
84
|
TX0p
|
|
|
25
Gbps transmitter data; Lane 0
|
|
85
|
TX0n
|
|
|
25
Gbps transmitter data bar; Lane 0
|
|
86
|
GND
|
|
|
|
|
87
|
TX1p
|
|
|
25
Gbps transmitter data; Lane 1
|
|
88
|
TX1n
|
|
|
25
Gbps transmitter data bar; Lane 1
|
|
89
|
GND
|
|
|
|
|
90
|
N.C.
|
|
|
|
|
91
|
N.C.
|
|
|
|
|
92
|
GND
|
|
|
|
|
93
|
N.C.
|
|
|
|
|
94
|
N.C.
|
|
|
|
|
95
|
GND
|
|
|
|
|
96
|
TX2p
|
|
|
25
Gbps transmitter data; Lane 2
|
|
97
|
TX2n
|
|
|
25
Gbps transmitter data bar; Lane 2
|
|
98
|
GND
|
|
|
|
|
99
|
TX3p
|
|
|
25
Gbps transmitter data; Lane 3
|
|
100
|
TX3n
|
|
|
25
Gbps transmitter data bar; Lane 3
|
|
101
|
GND
|
|
|
|
|
102
|
N.C.
|
|
|
|
|
103
|
N.C.
|
|
|
|
|
104
|
GND
|
|
|
|
CFP2 Lane Assignment
|
Lane
|
Center Frequency
|
Center Wavelength
|
Wavelength Range
|
|
L0
|
231.4 THz
|
1295.56 nm
|
1294.53 to 1296.59 nm
|
|
L1
|
230.6 THz
|
1300.05 nm
|
1299.02 to 1301.09 nm
|
|
L2
|
229.8 THz
|
1304.58 nm
|
1303.54 to 1305.63 nm
|
|
L3
|
229.0 THz
|
1309.14 nm
|
1308.09 to 1310.19 nm
|
Mechanical
Diagram

ORDERING INFORMATION
|
Part
Number
|
Description
|
|
SOFP2-LR4-10
|
CFP2 4*25G 10km, 0~70℃, with DDM
|
For More
Information
Contact
Shenzhen Sinovo
Telecom Co. Ltd
Website:www.sinovocorp.com Email:sales@sinovocorp.com
Tel:+86(0)0755-3295
9919 Fax:+86(0)755 3295 9918
Factory ADD: 4~5F,NO.658,Meijing West Rd,Dalang Town,Dongguan City, Guangdong,China
Head
Quarter:11/F,Taibang Technology Building,Gaoxin South 4th,Science and
Technology Park South,Nanshan,Shenzhen,China 518040



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