XFP Tunable DWDM Module Sinovo

Tunable Multiprotocol XFP Optical Transceiver — 1550 nm for up to 80 km reach

Supports 9.953 Gbps (SONET and SDH), 10.31 Gbps (Ethernet),

10.52 Gbps (Fibre Channel), and cor- responding forward error

correction (FEC) rates of

10.66/10.709/11.09/11.35 Gbps

• Monolithically integrated full C-band tunable transmitter

• 50 GHz ITU channel spacing with integrated wavelength locker

• Commercial operating temperature from -5˚C to 70˚C

• Maximum power dissipation of 3.5 W • No reference clock required

• Digital diagnostic monitoring support

Applications

• Wide, local, and storage area networks • SONET OC-192 and SDH STM-64 • Ethernet and Fibre Channel switches

The SINOVO tunable 10 G multiprotocol optical XFP transceiver is an integrated fiber optic transceiver that provides a high-speed serial link at signaling rates from 9.95 Gbps to 11.35 Gbps. The module complies with the 10 Gigabit small form factor pluggable (XFP) multisource agreement (MSA).

It complies with the ITU-T G.698.1 DN50S-2D2(C) standard with 50 GHz channel spacing for SONET/SDH, IEEE DWDM 10GBASE-ZR for 80 km reach (Ethernet), and DWDM 10GFC for 80 km reach (Fibre Channel) applications.

The transceiver integrates the receive and transmit path on one module. On the transmit side, the 10 Gbps serial data stream is recovered, retimed, and passed to a modulator driver. The modulator driver biases and modulates a C-band-tunable integrated laser Mach-Zehnder (ILMZ), enabling data transmission over single- mode fiber through an industry-standard LC connector. On the receive side, the 10 Gbps optical data stream is recovered from an APD/transimpedance amplifier, retimed, and passed to an output driver. This module features a hot-pluggable XFI-complian

SOXF-TD-80D

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Section 1

Functional Description

The SINOVO tunable XFP optical transceiver is a full-duplex serial electric, serial op- tical device with both transmit and receive functions contained in a single module that provides a high-speed serial link at signaling rates from 9.95 Gbps to 11.35 Gbps. It is designed to be compliant with the ITU-T G.698.1 DN50S-2D2(C) stan- dard with 50 GHz ITU grid channel spacing for 80 km reach (SONET or SDH), IEEE 10GBASE-ZR and 10GBASE-ZW DWDM for 80 km reach (Ethernet), and 10GFC DWDM for 80 km reach (Fibre Channel) applications. The transceiver is also fully compliant with the 10 Gigabit small form factor XFP pluggable module multisource agreement INF8077i Rev. 4.5. A block diagram of the transceiver is shown in Figure 1 below.

The transceiver locks to data without the requirement of a reference clock. The ref- erence clock inputs have an internal AC-coupled 100 ohm differential line-to-line termination. It has several low-speed interface connections including a two-wire serial interface. These connections include: module not ready (Mod_NR), module deselect (Mod_DeSel), interrupt, transmitter disable (TX_DIS), module absent (Mod_ABS), receive loss (RX_LOS), and power down/reset (P_Down/RST).

The transceiver also supports XFI system loopback. In this mode, data input on the electrical Tx pins of the XFP module is retimed and redirected to the Rx pins of the module. This facilitates system side test and debug.

1.1

Transmitter

The transmitter path converts serial NRZ electrical data from line rates of 9.95 Gbps to 11.35 Gbps to a standard compliant optical signal. The transmitter accepts a 100 Ω differential 120 mV peak-to-peak to 820 mV peak-to-peak 10 Gbps CML electrical signal on TD- and TD+ pins.

Inside the module, the differential signals pass through a signal conditioner with equalization that compensates for losses and deterministic jitter present on the input data stream. The transmit CDR function generates a clock that is at the same frequency as the incoming data bit rate of the electrical data input. The clock is phase aligned by a phase locked loop (PLL) that samples the data in the center of the data eye pattern. The CDR function does not require a reference clock to lock to incoming data. The CDR contains a lock detect circuit that indicates successful locking of the PLL onto the incoming data.

The output of the Tx signal conditioner is input to the modulator driver which transforms the small-swing digital voltage to an output modulation that drives a cooled InP ILMZ modulator. The optical signal is engineered to meet the SONET/SDH, 10 Gigabit Ethernet, 10 G Fibre Channel, and corresponding Forward Error Correction (FEC) rates DWDM specifications at ITU grids with 50 GHz channel spacing. The unit provides closed-loop control of transmitted laser power, modulation swing, center wavelength over temperature, and voltage variations. The laser is coupled to single-mode optical fiber through an industry- standard LC optical connector.

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1.2

Receiver

The receiver converts incoming DC-balanced, serial NRZ optical data from line rates of 9.95 Gbps to 11.35 Gbps into serial XFI electrical data. Light is coupled to an APD photodetector from single-mode optical fiber through an industry- standard LC optical connector. The electrical current from the APD photodetector is converted to a voltage in a transimpedance amplifier.

The amplified signal is passed to a signal-conditioning IC that provides clock and data recovery. The receive CDR function generates a clock that is at the same fre- quency as the incoming data bit rate of the optical data input. The clock is phase aligned by a PLL that samples the data in the center of the data eye pattern. The CDR function does not require a reference clock to lock to incoming data. The CDR contains a lock detect circuit that indicates successful locking of the PLL onto the incoming data. Loss of signal and signal lock detection is included in the receive circuitry that is reflected in the Mod_NR status pin. The recovered data is output on the RD+ and RD- pins as a 100 Ω 340 mV peak-to-peak CML signal. The output signal meets XFP MSA requirements.

Figure 1.

Functional block diagram

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1.3

low-Speed Signaling

Low-speed signaling is based on low-voltage TTL (LVTTL) operating at a nominal voltage of 3.3 V.

SCL/SDA: Two-wire serial interface clock and data line. Hosts should use a pull- up resistor connected to Vcc 3.3 V on the two-wire interface SCL (clock), SDA (data), and all low-speed outputs.

Mod_NR: Output pin. High indicates the module has detected a condition that renders Tx and/or Rx data invalid.

Mod_DeSel: Input pin. Low indicates the module responds to two-wire serial communication commands. High indicates the module does not respond to or acknowledge any two-wire interface communication from the host.

Interrupt: Output pin. Low indicates a possible module operational fault or a sta- tus critical to the host system.

TX_DIS: Input pin. High indicates the transmitter output is turned off.

Mod_ABS: Output pin. High indicates the XFP module is absent. It is pulled low when the XFP module is inserted.

RX_LOS: Output pin. High indicates insufficient optical power for reliable signal reception.

P_Down/RST: Multifunction input pin. The module can be powered down or reset by pulling the low-speed P-Down pin high. In power down mode, no data is trans- mitted on the optical Tx or the electrical Rx path. The reset pulse is generated on the falling edge of the P-Down signal. Following reset, the internal PLLs must reacquire lock and will temporarily indicate a Mod_NR failure until the PLLs reacquire lock.

Section 2

Application Schematics

Recommended MSA connections to the transceiver are shown in Figure 2 on page 5.

Power supply filtering is recommended for the transceiver. To limit wide-band noise power, the host system and module shall each meet a maximum of 2% peak- to-peak noise when measured with a 1 MHz low-pass filter. In addition, the host system and the module shall each meet a maximum of 3% peak-to-peak noise when measured with a filter from 1 MHz – 10 MHz.

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Section 3

Specifications

Technical specifications related to the tunable 10 Gbps multiprotocol optical XFP transceiver includes: • Section 3.1Pin Function Definitions • Section 3.2XFP/XFI Reference Model Compliance Points • Section 3.3Absolute Maximum Ratings • Section 3.4Operating Conditions • Section 3.5Electrical Characteristics • Section 3.6Jitter Specifications • Section 3.7XFP Two-Wire Interface Protocol and Management Interface • Section 3.8Optical Transmitter Characteristics • Section 3.9Optical Receiver Characteristics • Section 3.10Regulatory Compliance • Section 3.11PCB Layout • Section 3.12Module Outline • Section 3.13Connectors

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3.1

Pin Function Definitions

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Table 1. XFP Optical Transceiver Pin Descriptions

Pin Number

1 2 3

4

5 6 7 8 9 10 11 12

13 14 15 16 17 18 19 20 21

Type

Name

GND1 VEE5 Mod_Desel

Interrupt2

TX_DIS VCC5 GND1 VCC3 VCC3 SCL2 SDA2 Mod_Abs2

Mod_NR2 RX_LOS2 GND1 GND1 RD- RD+ GND1 VCC2  P_Down/RST

Description

Module ground Not used; may be left unconnected (Optional -5.2 V Power Supply). Module de-select: when held low, allows the module to respond to 2-wire serial interface commands. Interrupt: indicates presence of an important condition which can be read over the serial 2-wire interface. Transmitter disable: transmitter laser source turned off +5 V power supply Module ground +3.3 V power supply +3.3 V power supply Two-wire interface clock Two-wire interface data line Indicates module is not present. Connected to ground with 302 Ω resistor. Module not ready: indicating module operational fault Receiver loss of signal indicator Module ground Module ground Receiver inverted data output Receiver noninverted data output Module ground +1.8 V power supply   Power down; when high, the module limits power consumption to 1.5 W or below. Serial interface is functional in the low power mode. Reset: the falling edge initiates a complete reset of the module including the serial interface, equivalent to a power cycle. +1.8 V power supply Module ground Reference clock noninverted input (not used) Reference clock inverted input (not used) Module ground Module ground Transmitter inverted data input Transmitter noninverted data input Module ground

LVTTL-I

LVTTL-O

LVTTL-I

LVTTL-I LVTTL-I/O LVTTL-O

LVTTL-O LVTTL-O

CML-O CML-O

LVTTL-I

22 23 24 25 26 27 28 29 30

PECL-I PECL-I

CML-I CML-I

VCC2 GND1 RefCLK+ RefCLK- GND1 GND1 TD- TD+ GND1

1. Module ground pins (GND) are isolated from the module case and chassis ground within the module. 2. Shall be pulled up with 4.7 kΩ – 10 kΩ to a voltage between 3.15 V and 3.45 V on the host board.

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3.2

XFP/XFI Reference Model Compliance Points

3.3

Absolute Maximum Ratings

Parameter

Storage temperature Operating case temperature Relative humidity Static electrical discharge (Human Body Model) Power supply voltages

Receive input optical power (damage threshold)

Symbol

TST  TOP RH ESD VCC2, max VCC3, max VCC5, max Pdth

Ratings

-40 to +85 -5 to +70   5 to 85 (non-condensing)   500  -0.3 to 1.98  -0.3 to 3.63  -0.5 to 6.0  +3

Unit

˚C ˚C  %  V V V V dBm

Note: Absolute maximum ratings represent the damage threshold of the device. Damage may occur if the device is operated above the limits stated here except for brief excursions. Performance is not guaranteed and reliability is not implied for operation at any condition outside the recommended operating limits.

3.4

Operating Conditions

Part Number

Chromatic Dispersion (-400 ps/nm)

Chromatic Dispersion (1600 ps/nm)

X

Commercial Temperature (-5˚C – 70˚C)

X

XFP-DWDM-T10G80xx X

Note: Performance is not guaranteed and reliability is not implied for operation at any condition outside the recommended operating limits.

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3.5

Electrical Characteristics

Parameter

Symbol

Minimum

Typical

Maximum

Unit

Notes

With respect to GND With respect to GND With respect to GND 3.3 V 5.0 V 1.8 V

Rpullup pulled to host _Vcc, measured at host side of connector. IOL(max)=3 mA Rpullup pulled to host _Vcc, measured at host side of connector. Pulled up in module to Vcc3 Pulled up in module to Vcc3 Rpullup pulled to host _Vcc, measured at XFP side of connector. Rpullup pulled to host _Vcc, measured at XFP side of connector.

Supply currents and voltages Voltage3VCC33.133.33.47V Voltage5VCC54.7555.25V Voltage2VCC21.711.81.89V Supply current3ICC3750mA Supply current5ICC5500mA Supply current2ICC21000mA Power dissipationPwr3.5W Low speed control and sense signals (detailed specification in XFP MSA INF8077i Rev. 4.5) Outputs (Interrupt,VOL00.4V Mod_NR, RX_LOS)

VOH

Inputs (TX_DIS,VIL P_Down/RST, M_DSEL) VIH SCL and SDA inputsVIL

VIH

host_Vcc-0.5

-0.3 2 -0.3

Vcc3*0.7

host_Vcc+ 0.3

0.8 Vcc3+ 0.3 Vcc3*0.3

Vcc3+0.5

V

V V

Transmitter input (detailed specification in XFP MSA INF8077i Rev. 4.5) Data input baud rate nominal9.9511.35 Data input bit rate tolerance-100+100 (10GbE/10GFC) Data input bit rate tolerance-20+20 (SONET/SDH) Data input complianceB Data input differential RI90100110 impedance Receiver output (detailed specification in XFP MSA INF8077i Rev. 4.5) Data output baud rate nominal9.9511.35 Data output complianceC Data output bit rate stability-100+100 (10GbE / 10GFC) Data output bit rate stability-20+20 (SONET/SDH)

Gbps ppm

ppm

Internally AC-coupled signals

Ω

Gbps

Internally AC-coupled signals

ppm

ppm

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3.6

Jitter Specifications

Parameter

Symbol

Min

Max

Unit

Notes

Transmitter electrical input jitter from host at B (detailed specification in XFP MSA INF8077i Rev. 4.5) Total non-EQJ jitter0.41UI(p-p)Total jitter less ISI Total jitterTJ0.61UI(p-p) Eye maskX10.305UIMask coordinate X1=0.205 if total non-DDJ                                                                                            is measured. Eye maskY160mV Eye maskY2410mV50 mV is allocated for multiple reflections. Receiver electrical output jitter to host at C (detailed specification in XFP MSA INF8077i Rev. 4.5) Deterministic jitterDJ0.18UI(p-p)Includes jitter transferred from the optical receiver                                                                                           during any valid operational input condition. Total jitterTJ0.34UI(p-p)Includes jitter transferred from the optical receiver                                                                                             during any valid operational input condition. Eye maskX10.17UI Eye maskX20.42UI Eye maskY1170mV Eye maskY2425mV Jitter transfer bandwidth BW8MHzPRBS 231-1, OC-192 / SDH-64                                                                                             Sinusoidal jitter tolerance mask Jitter peaking1dBFrequency >120 KHz                                                                 0.3UIpp20 KHz to 80 MHzTransmitter jitter generation                                                                 0.1UIpp4 MHz to 80 MHz

3.7

XFP Two-wire Interface Protocol and Management Interface

The transceiver incorporates an XFP-compliant, two-wire management interface which is used for serial ID, digital diagnostics, and certain control functions. It is modeled on the SFF-8472 Rev 9.3 specification modified to accommodate a single two-wire interface address. In addition to the basic I2C read/write functionality, the modules support packet error checking that, when enabled, allows the host system to confirm the validity of any read data. Details of the protocol and interface are explicitly described in the MSA. Please refer to the MSA for design reference.

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AFT DR

Figure 5.

XFP two-wire serial digital diagnostic memory map

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3.8

Optical Transmitter Characteristics

Parameter

Average optical power (EOL) Extinction ratio1 Wavelength range2 Frequency range3 Channel spacing Frequency stability (BOL) Frequency stability (EOL) Channel tuning time4 Side-mode suppression ratio Relative intensity noise Return loss tolerance

Symbol

Pavg

ER λc

Minimum

-1.0

9 1528.384 191.1      50       ƒc-1.5       ƒc-2.5

Typical

Maximum

3.0

1568.773 196.15

Unit

dBm   dB nm  THz    GHz   GHz   GHz ms    dB    dB/Hz  dB

ƒc ƒc

50

ƒc+1.5 ƒc+2.5

-130 27

SMSR RIN

35

Note: Specifications are applicable to the operating temperature range listed in Section 3.4. 1. Tested with PRBS 231-1 pattern 2. ITU grid wavelength 3. ITU grid frequency 4. Any channel to any channel

3.9

Optical Receiver Characteristics

Parameter

Center wavelength Receiver sensitivity (EOL)1      Back to back (0 ps/nm)       Fiber (-400 to 1600 ps/nm) Receive overload2 Receiver reflectance LOS assert LOS deassert LOS hysteresis

Symbol

λ

Rsen    Rsenf

Pmax

Rrx Plos_on Plos_off

-7

Minimum

1260

Typical

Maximum

1600

-24 -21.5

Unit

nm

dBm dBm  dBm dB   dBm   dBm  dB

-33.5 -33 0.5

-27    -28    -26   4

Note: Specifications are applicable to the operating temperature range listed in Section 3.4. 1. Guaranteed at 10.709 Gbps. Measured with worst ER; BER<10-12; PRBS 231-1 pattern. 2. Guaranteed up to 10.709 Gbps.

3.10 Regulatory Compliance

The transceiver is lead-free and RoHS 6/6 compliant.

The transceiver complies with international electromagnetic compatibility (EMC) and safety requirements and standards. EMC performance depends on the overall system design. Information included herein is intended for use as a basis for de- sign decisions and any subsequent system-level testing and certifications.

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Table 2. Regulatory Compliance

Feature

Safety Product safety

Test Method

UL 60950-1 CSA C22.2 No. 60950-1 EN 60950-1 IEC 60950-1 Flame Class V-0 Low Voltage Directive 2006/95/EC EN 60825-1, EN 60825-2 IEC 60825-1 U. S. 21CFR 1040.10

EMC Directive 2004/108/EC FCC rules 47 CFR Part 15 CISPR 22 AS/NZS CISPR22 EN 55022 ICES-003, Issue 5 VCCI V-3 EMC Directive 2004/108/EC CISPR 24 EN 55024 IEC/EN 61000-4-2

IEC/EN 61000-4-3

Performance

UL-recognized component for US and CAN

TUV certificate CB certificate Passes needle-point flame test. Certified to harmonized standards listed; Declaration of Conformity issued. TUV Certificate CB certificate FDA/CDRH certified with accession number; Class 1 laser product.

Class B digital device with a minimum -2 dB margin to the limit when tested in a representative host. Tested frequency range: 30 MHz to 40 GHz or 5th harmonic (5 times the highest frequency), whichever is less. Good system EMI design practice is required to achieve Class B margins at the system level.

Laser safety

Electromagnetic Compatibility Radiated emissions

Immunity

ESD

Radiated immunity

Exceeds requirements. Withstands discharges of ±8 kV contact, ±15 kV air. Exceeds requirements. Field strength of 10 V/m from 10 MHz to 1 GHz. No effect on transmitter/receiver performance is detectable between these limits.

Compliant per the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 and the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.A RoHS Certificate of Conformance (C of C) is available upon request.The product may use certain RoHS exemptions.

Restriction of Hazardous Substances (RoHS) RoHSEU Directive 2002/95/EC +                                            EU Directive 2011/65/EU

3.11

PCB layout

Recommended PCB layout is given in XFP MSA INF8077i Rev. 4.5.

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3.12 Module Outline

Figure 6.

Belly-to-belly mounting recommendation

3.13 Connectors

Fiber

The XFP module has a duplex LC receptacle connector.

Electrical

The electrical connector is the 30-way, two-row PCB edge connector. The customer connector is Tyco/AMP Part No. 788862C or equivalent.

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Section 4

Related Information

Other information related to the transceiver includes: • Section 4.1 Packing and Handling Instructions • Section 4.2 Electrostatic Discharge (ESD) • Section 4.3 Laser Safety

4.1 Package and Handling Instructions

Connector Covers

The transceiver is supplied with an LC duplex receptacle. The connector plug supplied protects the connector during standard manufacturing processes and handling by preventing contamination from dust, aqueous solutions, body oils, and airborne particles.

Note: It is recommended that the connector plug remain on whenever the trans- ceiver optical fiber connector is not inserted.

Recommended Cleaning and Degreasing Chemicals

SINOVO recommends the use of methyl, isopropyl and isobutyl alcohols for cleaning.

Do not use halogenated hydrocarbons (e.g. trichloroethane, ketones such as ac- etone, chloroform, ethyl acetate, MEK, methylene chloride, methylene dichloride, phenol, N-methylpyrolldone).

This product is not designed for aqueous wash.

Housing

The transceiver housing is made from zinc.

4.2 Electrostatic Discharge (ESD)

Handling

Normal ESD precautions are required during the handling of this module. This transceiver is shipped in ESD protective packaging. It should be removed from the packaging and otherwise handled in an ESD protected environment utilizing standard grounded benches, floor mats, and wrist straps.

Test and Operation

In most applications, the optical connector will protrude through the system chas- sis and be subjected to the same ESD environment as the system. Once properly installed in the system, this transceiver should meet and exceed common ESD test- ing practices and fulfill system ESD requirements.

Typical of optical transceivers, this module’s receiver contains a highly sensitive optical detector and amplifier which may become temporarily saturated during an ESD strike. This could result in a short burst of bit errors. Such an event might require that the application re-acquire synchronization at the higher layers (for example, via a serializer/deserializer chip).

TUNABlE MUlTIPROTOCOl XFP OPTICAl TRANSCEIvER— 1550 NM FOR UP TO 80 KM REACH

4.3 laser Safety

The transceiver is certified as a Class 1 laser product per international standard IEC 60825-1:2007 2nd edition and is considered non-hazardous when operated within the limits of this specification. This device complies with 21 CFR 1040.10 except for deviations pursuant to Laser Notice No. 50 dated June 24, 2007.

Operating this product in a manner inconsistent with intended usage and specifi- cation may result in hazardous radiation exposure.

Caution

Operating this product in a manner inconsistent with intended usage and specifi- cations may result in hazardous radiation exposure.

Use of controls or adjustments or performance of procedures other than these specified in this product data sheet may result in hazardous radiation exposure.

Tampering with this laser product or operating this product outside the limits of this specification may be considered an “act of manufacturing” and may require recertification of the modified product.

Viewing the laser output with certain optical instruments (for example, eye loupes, magnifiers, microscopes) within a distance of 100 mm may pose an eye hazard.

Order Information

Model No.

SOXF-TD-40D

SOXF-TD-80D

Data

10G

10G

Wavelength

Tunable wavelength

Tunable wavelength

Material

DWDM+PIN

DWDM+APD

Fib

SM

SM

Distance

40km

80km

D